Vitrified Bond Diamond vhiri back Digining vhiri yekugeda pamusoro pekukuya silicon wafer

Vitrified Bond Diamond vhiri remagetsi kudzoka vhiri rekukuvadzwa pamusoro pekuchera silicon wadared mufananidzo

Tsananguro pfupi:

Back back mavhiri acho anonyanya kushandiswa pakutetepa uye kwakanaka kugeda kweiyo silicon wafer. Zvigadzirwa izvi zvinogadzirwa neye yedu Institute iyo ine yepamusoro yekugeza kuita uye mutengo wakakwira.
Kuita kuri pakati pechikamu chepamusoro pasi rese. Vanogona kushandiswa neJapan, chiGerman, American, Korea uye Chinese Grinders.

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Chigadzirwa Chinhu

Zvigadzirwa tags

Vitrified Chisungo Back Digining vhiri
Iyi nhevedzano yeVhidhiyo Yevheji inonyanya kushandiswa kudzoka uye yekunyora yekugadzirisa Semiconductor Wafers, Discrete Circes, Yakabatanidzwa Dunhu Rinonyudza Licon Wafers, uye Raw Silicon Wafers.
Resin Bond Back Digining vhiri
Resin Bond Boka Rekuchera vhiri rinogadzirwa kubva kuTernomet Resin uye Diamondi, iyo inoshandiswa silicon Wafers, Safira, Galari Nitride, Gallium Arsenide.

Modhi	D (mm)	T (mm)	H (mm)
6a2 / 6a2h	175	30, 35	76
	200	35	76
	350	45	127
6a2t	195	22.5, 25	170
6a2t	280	30	228.6
6A2T (matatu ellipses)	350	35	235
6A2T (matatu ellipses)	209	22.5	158
Zvimwe zvimwe zvinogona kugadzirwa zvichienderana nezvinodiwa nevatengi.

Zvakanakira kumashure kwembiru yekukwevera
1. Nekukuvara kwakaderera uye mhando yepamusoro
2.odeless inoteedzana yekugadzirisa inogoneka neyakanyanya kupinza
3. Inobatsira kuderedza kugadzirisa kukuvara, kuvandudza kugadzirisa kwekugadzirisa uye kuderedza mari yekugadzirisa, uye inoenderana maererano nezvinodiwa nevatengi

1.Application yekudzokera kumashure vhiri:
Kudzoka Kwemashure, Kukumira Kwemberi uye Kucheka Kwemidziyo yeDhiri Sportrate.
2..
3.
4. Zvishandiso: Kudzoka kuonda, kuomarara nekukuya uye kwakanaka kugeda
5.Applable Kugaya Machine: Mavhiri ekukwevera anokwanisa kushandiswa kweJapan, chiGerman, Koreya uye neNTS, Shuwa, okamoto, Disco, tsk uye etc).