12a1 wafer hub dicing saw akaona blade diamondi dhidhi dhizaini dzeWafer Kupinda

12a1 wafer hub diting saw akaona blade diamondi DICING Blades for WAFER SEALSE KUSVIRA PAKUTI Mufananidzo

Tsananguro pfupi:

Diamond Dicing blade inoshandiswa kugomera, kucheka silicon wafer, compound semiconducductrs, girazi uye zvimwe zvigadzirwa mumaindasitiri emagetsi. Blads yedu inonamira inosanganisira diamondi hub diting blade uye diamondi hiness dicing blade. MaBinder anosanganisira resin bond Dicing blade, metal bond dicing blade uye electromed nickel dicing blade.this mhando yakagadzirwa magadzirirwo.

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Chigadzirwa Chinhu

Zvigadzirwa tags

Chishandiso: Kunyora Dicing Ic WAFERS, Galari Arsenide, Gallium Arsenide, Eporo Resin Board, Alloy Resin, Ceramic Substrate, Bhodhi reChinyorwa, Composite Bhodhi neInterlayer, nezvimwewo
Kusarudza kusarudzwa kwemhando dzakarongeka dzeWerfe Dicing Cicing Bhandi kucheka zvinhu?
* Binder of resin Bond (SIMBA SIMBA) DICING BLEDE, kunyorera yakaoma uye brittle zvinhu
* Binder yesimbi yesimbi (yepakati simba) dhizaini blade
* Binder yeAlectroplated Bond (Hard Bond), Kupindira Zvinhu Zvinofadza

Zvakanakira Wafer Hub Dicing Saw Blades
Yakakura yekucheka cutting - inovimbisa kuchena uye kwakaringana nekucheka kushoma muchipping.
Superior Blade kuomarara - kuderedza blade vibration yekuvandudzwa kwekucheka kugadzikana.
Kuonda kerf dhizaini - kuderedza kurasikirwa kwezvinhu uye kusimudzira gohwo.
Yakawedzerwa Blade Hupenyu - Yakagadziriswa kuti isimbe uye isingaenderane kuita.
Yakasarudzika yakatarwa - inowanikwa mune dzakasiyana ukobvu, diameters, uye hukuru hwehukuru kuenzanisa zvakanyatso.